The production of semiconductor wafers requires very high quality. Any flaws and stains on the wafer surface will cause chip loss. Therefore, it is necessary to use a specific wafer contact angle measuring instrument to detect the wettability of the wafer surface to determine whether the wafer surface is not. (the following examples are all of Sindin Precision SDC-580 automatic wafer-type contact angle measuring instrument).
Fully automatic wafer contact angle measuring instrument SDC-580
Semiconductor Wafer Contact Angle Measurement
The contact angle refers to the tangent of the gas-liquid interface at the intersection of gas, liquid and solid. The tangent is between the liquid and the solid-liquid interface. The contact angle is the main factor to characterize the surface wetting properties of materials today.
Sindin Precision SDC-580 automatic wafer contact angle measuring instrument is a set of wafer contact angle testing equipment tailored for wafer wafer customers, which can meet the multi-point testing of 6-12 inch wafer samples at the same time; compared to The measuring instruments of other brands can test up to 12 points, and the Sindin wafer model can measure 50 points at one time, and the data can be directly displayed and saved in the original image.
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Automatic wafer contact angle measuring instrument with 50 multi-point tests
Application of automatic wafer contact angle measuring instrument:
1. Contact angle and wettability of liquid on solid surface: including static contact angle, dynamic contact angle (advance/receding contact angle), contact angle hysteresis, etc.;
2. The initial sliding angle (or rolling angle) and sliding speed of the droplet on the solid surface; (expansion function)
3. Wetting behaviors such as spreading, penetration/absorption of liquids on solid surfaces;
4. The surface free energy of the solid, and the contribution of various molecular interaction forces (such as polar/nonpolar);
5. Adhesion, retention, etc. of liquid on solid surface;
6. Evaluation of the results (effects) of solid surfaces after cleaning and treatment: such as cleanliness, homogeneity, and surface energy changes;
7. Surface/interface tension of liquid/flow-system: including measurement of static and dynamic surface/interface tension;
8. On-site, online and real-time monitoring of surface/interfacial tension and surface active ingredient content;
9. Measurement of critical micelle solubility (CMC) of surface active substances (such as surfactants): including automatic CMC measurement, automatic formula screening and optimization;
10. Research on the adsorption, arrangement, orientation, relaxation and other phenomena of surface active substances at the interface;
11. Viscoelasticity and stability of liquid interface: measurement and analysis of various interfacial phenomena and processes related to liquid/fluid/solid-system, such as the stability study of emulsion/foam systems, etc.
12. The overall solution for automatic detection can be used with the assembly line to improve the detection efficiency;
To put it simply, it is to measure the wetting behavior of the surface of the wafer material, such as spreading, penetration, and absorption, to measure the static and dynamic contact angles, to measure and analyze the surface free energy of solids, the interface and surface tension of liquids, automatic injection systems, forward and backward. the above is a brief introduction to the wafer automatic contact angle measuring instrument, and you can also use it as a reference when purchasing.